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Economy 14/06/2025 Uzbekistan and Malaysia’s MIMOS Sign Memorandum on Cooperation in Semiconductors and AI

Uzbekistan and Malaysia’s MIMOS Sign Memorandum on Cooperation in Semiconductors and AI

Tashkent, Uzbekistan (UzDaily.com) — On 13 June, Deputy Prime Minister and Minister of Economy and Finance of the Republic of Uzbekistan Jamshid Kuchkarov held a meeting with a delegation led by Saat Shukri Embong, President of Malaysia’s MIMOS Berhad research center.

The meeting marked a significant step toward the practical implementation of key areas of cooperation outlined during the official visit of the President of Uzbekistan to Malaysia in February this year, particularly in microelectronics, semiconductors, artificial intelligence, and advanced technologies.

During the meeting, the Malaysian side presented an overview of the capabilities of the country’s research institutes, production clusters, and innovation infrastructure. MIMOS Berhad showcased its developments in artificial intelligence, semiconductors, sensor technologies, and cutting-edge innovations.

Both parties recognized the strong potential for localizing semiconductor production in Uzbekistan, establishing supply chains for components, and ensuring energy sustainability in the sector. Special emphasis was placed on the integration of science, education, and manufacturing with the involvement of local enterprises, higher education institutions, and research organizations.

The Malaysian delegation also visited several local companies in Tashkent and expressed readiness to offer tailored technical assistance, infrastructure support, and partnership opportunities to individual firms operating in the sector.

As a result of the discussions, a Memorandum of Understanding was signed between the Ministry of Economy and Finance of Uzbekistan, the “UzElTechSanoat” Association, and MIMOS Berhad.

At the conclusion of the meeting, both sides acknowledged Uzbekistan’s strong potential in the emerging and strategically important fields of semiconductors and microelectronics, and agreed to pursue consistent development of bilateral cooperation — including talent development, engagement of young professionals, attraction of international investment, and joint project implementation.

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